Raghavan, JV and Dorai, VK and Sagar, SK and Sivaraman, A and Kalpana S, R and Jhunjhunwala, S (2022) Immunomodulatory Bandage for Accelerated Healing of Diabetic Wounds. In: ACS Bio and Med Chem Au, 2 (4). pp. 409-418.
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Abstract
Diabetic foot ulcers are challenging to treat. Current strategies to treat these wounds focus on preventing infection and promoting tissue regrowth but are ineffective in many individuals. Low-grade chronic inflammation is present in individuals with diabetes, and altering the inflammatory responses at the wound site could be an alternate approach to promote healing. We hypothesized that immunomodulation of the wound microenvironment would result in accelerated healing. To test this hypothesis, we began by characterizing the changes in the myeloid cell phenotype in a mouse model leptin receptor knockout (KO) mouse that closely mimics the type 2 diabetes condition observed in humans. We observed increased numbers of monocytes and neutrophils in the circulation of the KO mice compared to that in wild-type control mice. We also observed several phenotypic changes in neutrophils from the KO diabetic mice, suggesting low-grade systemic inflammation. Hence, we developed a rapamycin-loaded chitosan scaffold that may be used to modulate immune responses. The use of these immunomodulatory scaffolds at a wound site resulted in accelerated healing compared to the healing using blank scaffolds. In summary, our data suggest that immunomodulation may be a viable strategy to promote the healing of wounds in individuals with diabetes.
Item Type: | Journal Article |
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Publication: | ACS Bio and Med Chem Au |
Publisher: | American Chemical Society |
Additional Information: | The copyright for this article belongs to the Authors. |
Keywords: | chronic wounds; diabetes; diabetic foot ulcers; healing; immunomodulation; inflammation; rapamycin |
Department/Centre: | Division of Interdisciplinary Sciences > Centre for Biosystems Science and Engineering |
Date Deposited: | 05 Oct 2022 05:02 |
Last Modified: | 05 Oct 2022 05:02 |
URI: | https://eprints.iisc.ac.in/id/eprint/77023 |
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