Kumar, Praveen and Dutta, Indranath and Huang, Zhiheng and Conway, Paul (2017) Microstructural and Reliability Issues of TSV. [Book Chapter]
Full text not available from this repository.Abstract
The copper pumping problem exemplifies the complex reliability issues still to be resolved for TSV structures. From a materials science perspective the reliability issues presented by TSVs are linked to manufacturing processes and the resultant microstructure formed. Routine finite element-based reliability studies that treat the TSV filler as an isotropic and homogeneous material are not capable of providing a sufficiently thorough explanation of the observed copper extrusion/intrusion behavior. Rather, the material behavior and properties at multiple scales are required as the input data for effective reliability analysis of three-dimensional TSV stacked ICs. Such 3-D ICs also push the scale of materials to a limit where the anisotropy of material properties, recovery, recrystallization, and time-dependent phase morphological evolution further complicate reliability issues. This chapter reviews both experimental and modeling approaches that address the microstructural and reliability issues of TSVs. Crystal plasticity-based finite element method and phase field crystal method with an inherently multiscale nature are identified as promising modeling techniques to enable atomistically informed reliability analysis of TSVs.
| Item Type: | Book Chapter |
|---|---|
| Series.: | Springer Series in Advanced Microelectronics |
| Publisher: | Springer Verlag |
| Additional Information: | The Copyright of this article belongs to the Springer |
| Keywords: | Hydrostatic Stress; Void Growth; Interfacial Shear Stress; Reliability Issue; Body Center Cubic |
| Department/Centre: | Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy) |
| Date Deposited: | 29 May 2022 04:56 |
| Last Modified: | 31 May 2022 04:56 |
| URI: | https://eprints.iisc.ac.in/id/eprint/72571 |
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