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Conference Proceedings

Govindan, S and Bharath, K and Gope, D and Venkataraman, S and Ambasana, N (2019) A method to model Vccinfeedthrough Noise in Microprocessors with Fully Integrated Voltage Regulators - Distributed Formulation. In: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 6-9 Oct. 2019, Montreal, QC, Canada, Canada.

Conference Paper

Rao, SR and Ishibashi, N and Nayak, B and Muniganti, H and Ambasana, N and Sahu, V and Gope, D and Devi, A (2022) Black-Box Behavioral DC-DC Converter IC Emission Model. In: 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022, 1 - 5 August 2022, Spokane, pp. 570-574.

Sahoo, M and Gope, D and Ambasana, N and Eesha, D and Chandrasekhar, A (2019) Hybrid 2D-3D Fast Electromagnetic Analysis aided by Pattern Recognition for Signal Integrity Analysis. In: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, 6 October 2019 through 9 October 2019, McGill University CampusMontreal; Canada.

This list was generated on Fri Apr 26 07:55:36 2024 IST.