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Number of items: 2.

Journal Article

Kubair, DV and Spearing, SM (2007) Cohesive zone model for direct silicon wafer bonding. In: Journal of Physics D-Applied Physics, 40 (10). pp. 3070-3076.

Kubair, DV and Spearing, SM (2006) Cohesive zone modelling of wafer bonding and fracture: effect of patterning and toughness variations. In: Journal of Physics D: Applied Physics, 39 (6). pp. 1050-1057.

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