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Cohesive zone modelling of wafer bonding and fracture: effect of patterning and toughness variations

Kubair, DV and Spearing, SM (2006) Cohesive zone modelling of wafer bonding and fracture: effect of patterning and toughness variations. In: Journal of Physics D: Applied Physics, 39 (6). pp. 1050-1057.

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Direct wafer bonding has increasingly become popular in the manufacture of microelectromechanical systems and semiconductor microelectronics components. The success of the bonding process is controlled by variables such as wafer flatness and surface preparation. In order to understand the effects of these variables, spontaneous planar crack propagation simulations were performed using the spectral scheme in conjunction with a cohesive zone model. The fracture-toughness on the bond interface is varied to simulate the effect of surface roughness (nanotopography) and patterning. Our analysis indicated that the energetics of crack propagation is sensitive to the local surface property variations. The patterned wafers are tougher (well bonded) than the unpatterned ones of the same average fracture-toughness.

Item Type: Journal Article
Publication: Journal of Physics D: Applied Physics
Publisher: Institute of Physics
Additional Information: Copyright to this article belongs to Institute of Physics.
Keywords: Cohesive zone model;Dynamic fracture;MEMS;Wafer bonding
Department/Centre: Division of Mechanical Sciences > Aerospace Engineering(Formerly Aeronautical Engineering)
Date Deposited: 28 Mar 2006
Last Modified: 19 Sep 2010 04:25
URI: http://eprints.iisc.ac.in/id/eprint/6133

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