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Sonawane, D and Kumar, P (2019) Effect of accelerated thermal cyclic loading on structural reliability of cu-filled TSV. In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 4-6 Dec. 2019, Singapore, Singapore, pp. 1-5.
Sonawane, D and Kumar, P (2021) Stability of Cu-islands formed on Si substrate via 'dewetting' under subsequent thermal cycling. In: Nanotechnology, 32 (19).
Sonawane, D and Kumar, P (2020) New insights into fracture of Si in Cu-filled through silicon via during and after thermal annealing. In: Engineering Fracture Mechanics, 238 .
Sonawane, D and Ramamurthy, PC and Kumar, P (2020) Mechanical Reliability of Photovoltaic Cells under Cyclic Thermal Loading. In: Journal of Electronic Materials, 49 (1). pp. 59-71.
Sonawane, D and Choudhury, A and Kumar, P (2020) New Insights into Dewetting of Cu Thin Films Deposited on Si. In: Langmuir, 36 (20). pp. 5534-5545.
