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Kumar, Praveen and Dutta, Indranath and Huang, Zhiheng and Conway, Paul (2017) Microstructural and Reliability Issues of TSV. [Book Chapter]
Kumar, Praveen and Dutta, Indranath (2013) Effect of substrate surface on electromigration-induced sliding at hetero-interfaces. In: JOURNAL OF PHYSICS D-APPLIED PHYSICS, 46 (15).
Sahaym, Uttara and Talebanpour, Babak and Seekins, Sean and Dutta, Indranath and Kumar, Praveen and Borgesen, Peter (2013) Recrystallization and Ag3Sn Particle Redistribution During Thermomechanical Treatment of Bulk Sn-Ag-Cu Solder Alloys. In: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 3 (11). pp. 1868-1875.
