ePrints@IIScePrints@IISc Home | About | Browse | Latest Additions | Advanced Search | Contact | Help

Microstructural and Reliability Issues of TSV

Kumar, Praveen and Dutta, Indranath and Huang, Zhiheng and Conway, Paul (2017) Microstructural and Reliability Issues of TSV. [Book Chapter]

Full text not available from this repository.
Official URL: https://doi.org/10.1007/978-3-319-44586-1_4


The copper pumping problem exemplifies the complex reliability issues still to be resolved for TSV structures. From a materials science perspective the reliability issues presented by TSVs are linked to manufacturing processes and the resultant microstructure formed. Routine finite element-based reliability studies that treat the TSV filler as an isotropic and homogeneous material are not capable of providing a sufficiently thorough explanation of the observed copper extrusion/intrusion behavior. Rather, the material behavior and properties at multiple scales are required as the input data for effective reliability analysis of three-dimensional TSV stacked ICs. Such 3-D ICs also push the scale of materials to a limit where the anisotropy of material properties, recovery, recrystallization, and time-dependent phase morphological evolution further complicate reliability issues. This chapter reviews both experimental and modeling approaches that address the microstructural and reliability issues of TSVs. Crystal plasticity-based finite element method and phase field crystal method with an inherently multiscale nature are identified as promising modeling techniques to enable atomistically informed reliability analysis of TSVs.

Item Type: Book Chapter
Series.: Springer Series in Advanced Microelectronics
Publisher: Springer Verlag
Additional Information: The Copyright of this article belongs to the Springer
Keywords: Hydrostatic Stress; Void Growth; Interfacial Shear Stress; Reliability Issue; Body Center Cubic
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 29 May 2022 04:56
Last Modified: 31 May 2022 04:56
URI: https://eprints.iisc.ac.in/id/eprint/72571

Actions (login required)

View Item View Item