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Ultrasonic Nondestructive Evaluation of Additively Manufactured Photopolymers

Sotelo, LD and Vignola, AO and Brown, CA and Sampath, K and Guild, MD (2023) Ultrasonic Nondestructive Evaluation of Additively Manufactured Photopolymers. In: Research in Nondestructive Evaluation .

Full text not available from this repository.
Official URL: https://doi.org/10.1080/09349847.2022.2155334

Abstract

Advanced applications of polymer additive manufacturing (AM) require knowledge of the material acoustic and complex elastic properties. Recently, ultrasound nondestructive evaluation (NDE) methods have been applied to the understanding of AM polymers manufactured with a variety of methods. Nonetheless, the available information is still limited to a few materials and frequency ranges, and knowledge of shear acoustic properties and complex elastic properties of AM polymers is lacking. In this study, ultrasound measurements of compressional and shear phase velocity and attenuation are used to experimentally determine the complex elastic properties of 14 AM photopolymers manufactured using PolyJet systems. The results provided here are expected to aid in design of advanced polymer AM structures, and highlight the value of ultrasound NDE for the characterization of AM polymers. © 2023 American Society for Nondestructive Testing.

Item Type: Journal Article
Publication: Research in Nondestructive Evaluation
Publisher: Taylor and Francis Ltd.
Additional Information: The copyright for this article belongs to Taylor and Francis Ltd.
Keywords: 3D printers; Acoustic properties; Additives; Nondestructive examination; Shear flow; Ultrasonic testing, Advanced applications; Application of polymers; Attenuation; Elastic properties; Material jetting; Non-destructive evaluation methods; Phase speed; Polyjet; Polymer additive; Ultrasonic nondestructive evaluation, Elasticity
Department/Centre: Division of Mechanical Sciences > Mechanical Engineering
Others
Date Deposited: 02 Feb 2023 10:22
Last Modified: 02 Feb 2023 10:22
URI: https://eprints.iisc.ac.in/id/eprint/79785

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