Integration of a Compliant Thermal Actuator for Unlatching in a Mems Latch Accelerometer

Ramanathan, M and Pratap, R (2019) Integration of a Compliant Thermal Actuator for Unlatching in a Mems Latch Accelerometer. In: 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, 23 June 2019 - 27 June 2019, Berlin, pp. 515-518.

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Abstract

We report the realization of a reusable MEMS g-switch (a latch accelerometer) integrated with a compliant thermal actuator for unlatching. The novelty here is in the tight integration of the unlatching actuator that uses the same latching beams used as electrodes for threshold g-sensing, thus introducing minimal additional components. Optimization on the device parameters is performed on an existing model of electro-thermal actuators to have a required deflection while maintaining a minimum temperature profile in the hot arm of the actuator beam. We show that the required tip displacement for unlatching is easily achieved. The results suggest that the integrated actuator is a feasible candidate for resetting MEMS latch switches. © 2019 IEEE.

Item Type:	Conference Paper
Publication:	2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Publisher:	Institute of Electrical and Electronics Engineers Inc.
Additional Information:	The copyright for this article belongs to Institute of Electrical and Electronics Engineers Inc.
Keywords:	Accelerometers; Microsystems; Solid-state sensors, Compliant actuator; Device parameters; Electro-thermal actuators; Inertial sensor; Integrated actuator; Minimum temperatures; Tight integrations; Tip displacement, Actuators
Department/Centre:	Division of Mechanical Sciences > Mechanical Engineering Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited:	23 Dec 2022 06:54
Last Modified:	23 Dec 2022 06:54
URI:	https://eprints.iisc.ac.in/id/eprint/78534

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