Balaji, NC and Mani, M and Venkatarama Reddy, BV (2019) Dynamic thermal performance of conventional and alternative building wall envelopes. In: Journal of Building Engineering, 21 . pp. 373-395.
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Abstract
The current study investigates the thermal performance parameters of the building wall envelopes. The two wall systems, homogenous and composite wall envelope configurations were considered in this study by adopting conventional and alternative building materials. The study is based on theoretical investigation in evaluating the thermal performance parameters of the building envelope by adopting admittance method and finite difference methods. The effects of various wall configurations on time lag and decrement factor, interior surface instantaneous thermal load and the influence of exterior surface heat transfer coefficient on the time lag and decrement factors have been studied. Even dynamic thermal performance parameters such as thermal admittance, decrement factor, surface factor and its time leads and heat capacitance, effect of thermal conductivity and optimum thickness for maximum energy storage also studied. The study results reveal the impact of various building material thermal properties and its configurations as envelope on the thermal performance parameters.
Item Type: | Journal Article |
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Publication: | Journal of Building Engineering |
Publisher: | Elsevier Ltd |
Additional Information: | The copyright for this article belongs to Elsevier Ltd. |
Keywords: | Building materials; Finite difference method; Heat transfer; Thermal conductivity, Admittance method; Alternative building materials; Building envelopes; Interior surfaces; Optimum thickness; Theoretical investigations; Thermal admittance; Thermal Performance, Walls (structural partitions) |
Department/Centre: | Division of Mechanical Sciences > Centre for Sustainable Technologies (formerly ASTRA) Division of Mechanical Sciences > Civil Engineering |
Date Deposited: | 15 Nov 2022 09:32 |
Last Modified: | 15 Nov 2022 09:32 |
URI: | https://eprints.iisc.ac.in/id/eprint/78035 |
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