Krishna, NP Vamsi and Sen, Prosenjit (2017) Effect of thermal cycling on electrical properties in 3D die level packaging. In: 3rd International Conference on Emerging Electronics, ICEE 2016, 27-30 December 2016, Mumbai, pp. 1-3.
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Official URL: https://doi.org/10.1109/ICEmElec.2016.8074604
Abstract
The current work characterizes the developed processing technology for 3-D die level packaging of hybrid systems. SU-8 has been used as the patternable interlayer dielectric between the device layers. We have studied the suitability of various epoxies for bonding the thinned dies and found EPO-TEK 377 epoxy to be the best one. The effect of thermal cycling on the electrical properties of each layer of the stack was characterized.
Item Type: | Conference Paper |
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Publisher: | Institute of Electrical and Electronics Engineers Inc. |
Additional Information: | The copyright for this article belongs to the Institute of Electrical and Electronics Engineers Inc. |
Keywords: | 3D Packaging; die stacking; Epoxy bonding; Integration; MEMS; ultrathin chip package |
Department/Centre: | Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering |
Date Deposited: | 07 Jun 2022 05:52 |
Last Modified: | 07 Jun 2022 05:52 |
URI: | https://eprints.iisc.ac.in/id/eprint/73225 |
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