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A step towards RoHS compliance for perovskite devices by using a novel lead-capturing encapsulant

Joji, J and Adiga, V and Nath, B and Ramamurthy, PC (2023) A step towards RoHS compliance for perovskite devices by using a novel lead-capturing encapsulant. In: Materials Today Sustainability, 23 .

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Official URL: https://doi.org/10.1016/j.mtsust.2023.100447


Despite the significant progress made in perovskite solar cells, device degradation under ambient conditions and the potentially hazardous release of toxic lead into the environment is a major concern. Packaging and encapsulation of solar cells and modules will address these issues to an extent. However, during leaching mobile lead ions can diffuse through most commercially used edge seal adhesives, making even standard encapsulation systems not appropriate for packaging perovskite solar cells. In this work, an ionomer of polyethylene co-methacrylic acid polymer film (Surlyn) modified with functional groups that interact with mobile lead ions is used to encapsulate perovskite films. The functionalization of the encapsulant was tailored by modifying the matrix polymer with Zeolitic imidazolium framework- 67 (ZIF-67) through polydopamine as the anchoring platform. This modified encapsulant exhibited a reduced lead leaching by more than ∼8 orders. The design of experiments was carried out to evaluate the modified encapsulant efficacy in preventing lead leaching through it. In addition, new experimental techniques were designed for understanding the characteristics and reliability for an extended period.

Item Type: Journal Article
Publication: Materials Today Sustainability
Publisher: Elsevier Ltd
Additional Information: The copyright for this article belongs to the Elsevier Ltd.
Keywords: Active encapsulant; Lead leakage; Lead-based perovskite; MOF.
Department/Centre: Division of Interdisciplinary Sciences > Interdisciplinary Centre for Energy Research
Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 29 Nov 2023 09:20
Last Modified: 29 Nov 2023 09:20
URI: https://eprints.iisc.ac.in/id/eprint/82898

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