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Orchid Micropropagation Using Conventional Semi-Solid and Temporary Immersion Systems: A Review

Nongdam, P and Beleski, DG and Tikendra, L and Dey, A and Varte, V and EL Merzougui, S and Pereira, VM and Barros, PR and Vendrame, WA (2023) Orchid Micropropagation Using Conventional Semi-Solid and Temporary Immersion Systems: A Review. In: Plants, 12 (5).

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Official URL: https://doi.org/10.3390/plants12051136


Orchids, with their astonishingly stunning flowers, dominate the international floricultural market. They are considered prized assets for commercial applications in pharmaceutical and floricultural industries as they possess high therapeutic properties and superior ornamental values. The alarming depletion of orchid resources due to excessive unregulated commercial collection and mass habitat destruction makes orchid conservation measures an extreme priority. Conventional propagation methods cannot produce adequate number of orchids, which would meet the requirement of these ornamental plants for commercial and conservational purposes. In vitro orchid propagation using semi-solid media offers an outstanding prospect of rapidly producing quality plants on a large scale. However, the semi-solid (SS) system has shortcomings with low multiplication rates and high production costs. Orchid micropropagation using a temporary immersion system (TIS) overcomes the limitations of the SS system by reducing production costs and making scaleup and full automation possible for mass plant production. The current review highlights different aspects of in vitro orchid propagation using SS and TIS and their benefits and drawbacks on rapid plant generation. © 2023 by the authors.

Item Type: Journal Article
Publication: Plants
Publisher: MDPI
Additional Information: The copyright for this article belongs to the Authors.
Keywords: conservation; explants; micropropagation; orchids; semi-solid media; temporary immersion system
Department/Centre: Division of Biological Sciences > Molecular Reproduction, Development & Genetics
Date Deposited: 05 Apr 2023 06:53
Last Modified: 05 Apr 2023 06:53
URI: https://eprints.iisc.ac.in/id/eprint/81158

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