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Thermokinetic stabilisation of nanocrystalline Cu by ternary approach

Sikdar, K and Mahata, A and Roy, B and Roy, D (2023) Thermokinetic stabilisation of nanocrystalline Cu by ternary approach. In: Philosophical Magazine, 103 (1). pp. 27-42.

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Official URL: https://doi.org/10.1080/14786435.2022.2122618


Nanocrystalline alloy design with the synergistic contribution of ‘thermodynamic’ and ‘kinetic’ stabilisation mechanism leads to much superior microstructural stabilisation at elevated temperatures. Ternary Cu98.5W1Zr0.5 (at. %) alloy, synthesised by mechanical milling under cryogenic temperature followed by consolidation through hot pressing at 550°C, has been examined to access the potential of their concurrence. A meager drop in hardness (∼0.5 GPa) confirms the stability of the alloy up to 800°C. The effect of alloy addition has been studied in terms of microstructure alteration, measured by X-ray diffraction, transmission electron microscopy, and Molecular dynamics (MD) simulation. In addition, the shear punch test (SPT) has been employed to assess the mechanical property of the consolidated alloy. Results suggest that the current approach provides a framework en route to designing bulk nanostructured alloys adapting the bottom-up method.

Item Type: Journal Article
Publication: Philosophical Magazine
Publisher: Taylor and Francis Ltd.
Additional Information: The copyright for this article belongs to Taylor and Francis Ltd.
Keywords: Copper; Copper alloys; Grain growth; Hardness; High resolution transmission electron microscopy; Hot pressing; Mechanical alloying; Milling (machining); Molecular dynamics; Nanocrystalline alloys; Nanocrystals; Stabilization; Ternary alloys, Alloy designs; Grain boundary pinning; Grain boundary segregation; Grain-boundaries; Kinetic stabilization; Microstructural stabilization; Nanocrystalline Cu; Stabilization mechanisms; Thermodynamics and kinetics; Thermokinetics, Grain boundaries
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 21 Feb 2023 03:41
Last Modified: 21 Feb 2023 03:41
URI: https://eprints.iisc.ac.in/id/eprint/80555

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