Precipitate evolution and thermal stability of A205 fabricated using laser powder bed fusion

Kulkarni, A and Srinivasan, D and Kumar, S and Kumar, P and Jayaram, V (2023) Precipitate evolution and thermal stability of A205 fabricated using laser powder bed fusion. In: Journal of Materials Science, 58 (5). pp. 2310-2333.

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Abstract

The thermal stability of laser power bed fusion A205 was studied via transmission electron microscopy (TEM) following various aging heat treatments. The effects of direct aging at 160 °C and 205 °C were compared with solutionizing and aging. The aging response was evaluated at three different temperatures (170 °C, 190 °C, 205 °C) up to 100 h. Solutionizing above solvus of the alloy at 530 °C with water quenching, followed by aging at 205 °C for 11 h, gave the optimum combination of high yield strength (376 MPa) and ductility (10%) at room temperature, which was retained up to 150 °C (yield strength of 314 MPa). Detailed TEM analysis coupled with atom probe tomography was used to reveal 20 × 1 nm2 clusters enriched in Cu and Ag in the As-printed condition, which evolved after aging as nanoscaled, Ω (Al–Ag–Cu–Mg) (55 × 7 nm2), and θ′ (Al–Cu) (40 × 5 nm2) precipitates, having an orientation relationship with α-Al, which resisted coarsening and were responsible for the thermal stability during aging up to 200 °C after aging for 100 h. Graphical abstract: [Figure not available: see fulltext.]

Item Type:	Journal Article
Publication:	Journal of Materials Science
Publisher:	Springer
Additional Information:	The copyright for this article belongs to Springer.
Keywords:	Coarsening; High resolution transmission electron microscopy; Ostwald ripening; Yield stress, Ageing response; Aging heat treatment; Direct aging; Higher yield; Laser powders; Laser power; Optimum combination; Powder bed; Solutionizing; Water quenching, Thermodynamic stability
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	09 Feb 2023 05:56
Last Modified:	09 Feb 2023 05:56
URI:	https://eprints.iisc.ac.in/id/eprint/80112

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