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Influence of Co content on the simultaneous enhancement of strength and ductility in severely drawn textured Ni-Co microwires

Bojjawar, G and Suwas, S and Chokshi, AH (2022) Influence of Co content on the simultaneous enhancement of strength and ductility in severely drawn textured Ni-Co microwires. In: Philosophical Magazine Letters .

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Official URL: https://doi.org/10.1080/09500839.2022.2129108

Abstract

This study examines the deformation behaviour of Ni-Co microwires exhibiting high strengths and ductility, where the addition of Co is intended to decrease the stacking fault energy. A reduction in stacking fault energy is likely to retard the recovery processes, refine grain size and enhance strain hardening by dislocation interactions at twin boundaries. Microwires were drawn to a strain of 5.88, from annealed Ni-Co alloys with Co content varying from 30 to 60 wt. Subsequent tensile testing revealed a simultaneous increase in strength and ductility with an increase in Co content. The enhanced strength is a consequence of the finer grain size with an increase in Co, and the larger ductility is related to a combination of greater strain hardening and a higher strain rate sensitivity with an increase in Co. The textured drawn Ni-Co wires exhibited higher strengths than those obtained by severe plastic deformation with comparable grain sizes.

Item Type: Journal Article
Publication: Philosophical Magazine Letters
Publisher: Taylor and Francis Ltd.
Additional Information: The copyright for this article belongs to Taylor and Francis Ltd.
Keywords: Binary alloys; Cobalt alloys; Ductility; Grain size and shape; Nickel alloys; Plastic deformation; Strain hardening; Strain rate; Tensile testing; Textures, Co content; Deformation behavior; Fault energy; Grainsize; Microwire; Ni-co microwire; Severe plastic deformations; Stacking fault energy; Strength; Strength and ductilities, Stacking faults
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 31 Oct 2022 09:07
Last Modified: 31 Oct 2022 09:07
URI: https://eprints.iisc.ac.in/id/eprint/77663

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