Tuning electromigration-thermomigration coupling in Cu/W Blech structures

Somaiah, N and Kumar, P (2018) Tuning electromigration-thermomigration coupling in Cu/W Blech structures. In: Journal of Applied Physics, 124 (18).

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Abstract

Here, we study the effect of electromigration-thermomigration coupling on enhanced mass transport and anomalous backward mass transport phenomenon at the cathode and the anode, respectively, in Cu thin films, by varying different experimental parameters, such as current density, interlayer thickness, and temperature. Test samples were fabricated as per the Blech configuration on a SiO2/Si substrate with a W interlayer in between the Cu film and the substrate. To interpret the experimental results, finite element analysis was performed. Increasing current density and temperature as well as decreasing interlayer thickness enhanced the net backward mass transport at the anode, as these factors led to a significant increase in the temperature gradient in the Cu film near the anode, thereby enhancing the electromigration-thermomigration coupling. This study provides a comprehensive understanding of minimizing the coupling of the aforementioned driving forces that cause the anomalous backward mass transport phenomenon at the anode in the interconnects.

Item Type:	Journal Article
Publication:	Journal of Applied Physics
Publisher:	American Institute of Physics Inc.
Additional Information:	The copyright for this article belongs to the Author(s).
Keywords:	Electromigration; Metallic films; Silica; Thin films; Transport properties, Cu films; Cu thin film; Driving forces; Experimental parameters; Interlayer thickness; Test samples; Thermomigration; Transport phenomena, Anodes
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	05 Aug 2022 05:22
Last Modified:	05 Aug 2022 05:22
URI:	https://eprints.iisc.ac.in/id/eprint/75153

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