Effect of thermal cycling on electrical properties in 3D die level packaging

Krishna, NP Vamsi and Sen, Prosenjit (2017) Effect of thermal cycling on electrical properties in 3D die level packaging. In: 3rd International Conference on Emerging Electronics, ICEE 2016, 27-30 December 2016, Mumbai, pp. 1-3.

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Abstract

The current work characterizes the developed processing technology for 3-D die level packaging of hybrid systems. SU-8 has been used as the patternable interlayer dielectric between the device layers. We have studied the suitability of various epoxies for bonding the thinned dies and found EPO-TEK 377 epoxy to be the best one. The effect of thermal cycling on the electrical properties of each layer of the stack was characterized.

Item Type:	Conference Paper
Publisher:	Institute of Electrical and Electronics Engineers Inc.
Additional Information:	The copyright for this article belongs to the Institute of Electrical and Electronics Engineers Inc.
Keywords:	3D Packaging; die stacking; Epoxy bonding; Integration; MEMS; ultrathin chip package
Department/Centre:	Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited:	07 Jun 2022 05:52
Last Modified:	07 Jun 2022 05:52
URI:	https://eprints.iisc.ac.in/id/eprint/73225

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