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Si-gold-glass hybrid wafer bond for 3D-MEMS and wafer level packaging

Reddy, Jayaprakash and Pratap, Rudra (2016) Si-gold-glass hybrid wafer bond for 3D-MEMS and wafer level packaging. In: JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 27 (1).

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Official URL: http://dx.doi.org/10.1088/0960-1317/27/1/015005


We report a relatively low temperature (< 400 degrees C) hybrid wafer bonding process that results in the simultaneous anodic and eutectic bonding in different predetermined regions of the wafer. This hybrid bonding process has potential applications in CMOS-MEMS device integration and wafer level packaging. We demonstrate the process by realizing a simple MEMS cantilever beam and a complex MEMS gyroscope structure. These structures are characterized for ohmic contact and electromechanical response to verify the electrical interconnect and the mechanical strength of the structure at the bond interface.

Item Type: Journal Article
Additional Information: Copy right for this article belongs to the IOP PUBLISHING LTD, TEMPLE CIRCUS, TEMPLE WAY, BRISTOL BS1 6BE, ENGLAND
Department/Centre: Division of Mechanical Sciences > Mechanical Engineering
Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited: 21 Dec 2016 07:22
Last Modified: 21 Dec 2016 07:22
URI: http://eprints.iisc.ac.in/id/eprint/55522

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