Khan, Sambuddha and Ananthasuresh, GK (2014) Improving the Sensitivity and Bandwidth of In-Plane Capacitive Microaccelerometers Using Compliant Mechanical Amplifiers. In: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 23 (4). pp. 871-887.
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Abstract
This paper presents a method to enhance both the sensitivity and bandwidth of in-plane capacitive micromachined accelerometers by using compliant mechanical amplifiers, and thus obviating the compromise between the sensitivity and bandwidth. Here, we compare one of the most sensitive single-axis capacitive accelerometers and another with large resonant frequency reported in the literature with the modified designs that include displacement-amplifying compliant mechanisms (DaCMs) occupying the same footprint and under identical conditions. We show that 62% improvement in sensitivity and 34% improvement in bandwidth in the former, and 27% and 25% in the latter can be achieved. Also presented here is a dual-axis accelerometer that uses a suspension that decouples and amplifies the displacements along the two in-plane orthogonal axes. The new design was microfabricated, packaged, and tested. The device is 25-mu m thick with the interfinger gap as large as 4 m. Despite the simplicity of the microfabrication process, the measured axial sensitivity (static) of about 0.58 V/g for both the axes was achieved with a cross-axis sensitivity of less than +/- 2%. The measured natural frequency along the two in-plane axes was 920 Hz. Displacement amplification of 6.2 was obtained using the DaCMs in the dual-axis accelerometer. 2013-0083]
Item Type: | Journal Article |
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Publication: | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS |
Publisher: | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, |
Additional Information: | Copy right for this article belongs to the IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, NJ 08855-4141 USA. |
Department/Centre: | Division of Mechanical Sciences > Mechanical Engineering |
Date Deposited: | 18 Oct 2014 06:53 |
Last Modified: | 18 Oct 2014 06:53 |
URI: | http://eprints.iisc.ac.in/id/eprint/50038 |
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