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The effect of ball milling on the melting behavior of Sn-Cu-Ag eutectic alloy

Reddy, Bhupal and Bhattacharya, P and Singh, Bawa and Chattopadhyay, K (2009) The effect of ball milling on the melting behavior of Sn-Cu-Ag eutectic alloy. In: Journal of Materials Science, 44 (9). pp. 2257-2263.

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Sn-Ag-Cu (SAC) solder alloys are the best Pb free alternative for electronic industry. Since their introduction, efforts are made to improve their efficacies by tuning the processing and composition to achieve lower melting point and better wettability. Nanostructured alloys with large boundary content are known to depress the melting points of metals and alloys. In this article we explore this possibility by processing prealloyed SAC alloys close to SAC305 composition (Sn-3wt%Ag-0.5wt%Cu) by mechanical milling which results in the formation of nanostructured alloys. Pulverisette ball mill (P7) and Vibratory ball mills are used to carry out the milling of the powders at room temperature and at lower temperatures (-104 A degrees C), respectively. We report a relatively smaller depression of melting point ranging up to 5 A degrees C with respect to original alloys. The minimum grain sizes achieved and the depression of melting point are similar for both room temperature and low-temperature processed samples. An attempt has been made to rationalize the observations in terms of the basic processes occurring during the milling.

Item Type: Journal Article
Publication: Journal of Materials Science
Publisher: Springer
Additional Information: Copyright of this article of belongs to Springer.
Department/Centre: Division of Mechanical Sciences > Mechanical Engineering
Date Deposited: 20 May 2009 07:43
Last Modified: 19 Sep 2010 05:30
URI: http://eprints.iisc.ac.in/id/eprint/19954

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