Pandey, Ashok K and Pratap, Rudra (2007) Modelling the Effect of Residual Stress and Perforations on the Dynamic Characteristics of MEMS Devices. In: Advances in Vibration Engineering .
Full text not available from this repository. (Request a copy)Abstract
Determination of dynamic characteristics of MEMS devices critically depends on accurate measurements of natural frequency and damping in the device. The natural frequency and damping on fabrication process dependent residual stress other than the usual design parameters of the structure. Similarly, perforations provided in the structure for etching purpose have profound effect on the squeeze film damping of the device. In this paper, we first experimentally determine the natural frequency and squeeze film damping in a MEMS device, and then present theoretical calculations for computing these quantities that include the effect of residual stress and perforations
Item Type: | Journal Article |
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Publication: | Advances in Vibration Engineering |
Publisher: | The Vibration Institute of India |
Additional Information: | The copyright belongs to The Vibration Institute of India. The publication is not yet available. |
Keywords: | MEMS;dynamic characteristics;residual stress;natural frequency;squeeze-film damping;perforations;microsystem analyzer;guided cantilever;quality factor |
Department/Centre: | Division of Mechanical Sciences > Mechanical Engineering |
Date Deposited: | 12 Nov 2007 |
Last Modified: | 07 Feb 2012 08:24 |
URI: | http://eprints.iisc.ac.in/id/eprint/12330 |
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