Number of items: 2.
Kanjilal, A and Kumar, P
(2020)
Insights into growth behavior of intermetallic compounds in Sn-Ag-Cu solder joints during mechanical and thermo-mechanical deformation processes.
In: 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019, 4-6 Dec. 2019, Marina Bay Sands Convention Centre, Singapore, pp. 48-52.
Sonawane, D and Kumar, P
(2019)
Effect of accelerated thermal cyclic loading on structural reliability of cu-filled TSV.
In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 4-6 Dec. 2019, Singapore, Singapore, pp. 1-5.
This list was generated on Sat Dec 21 20:19:08 2024 IST.
