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Kanjilal, A and Kumar, P (2020) Insights into growth behavior of intermetallic compounds in Sn-Ag-Cu solder joints during mechanical and thermo-mechanical deformation processes. In: 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019, 4-6 Dec. 2019, Marina Bay Sands Convention Centre, Singapore, pp. 48-52.
Kanjilal, A and Narayanan, PR and Agilan, M and Kumar, P (2022) Effect of Joint Size on Creep Behavior of Sn-Ag-Cu Solder-Cu Joints. In: Journal of Electronic Materials .
Kanjilal, A and P, RN and Kumar, P (2022) Size dependent creep deformation of elastically constrained compliant metallic joints. In: Materialia, 21 .
Somaiah, N and Kanjilal, A and Kumar, P (2020) Effects of an interfacial layer on stress relaxation mechanisms active in the Cu-Si thin film system during thermal cycling. In: MRS Communications, 10 (1). pp. 164-172.
