Toughened epoxy modified with phenol-nonyl phenol based polymer

Behera, D and Kar, S and Banthia, AK (2005) Toughened epoxy modified with phenol-nonyl phenol based polymer. In: Pigment and Resin Technology, 34 (4). pp. 184-189.

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Abstract

Purpose – To evaluate the efficiency of modifying epoxy resin using phenol-nonyl phenol based polymer (PNPF) for toughness improvement and optimise the results of such a modification. Design/methodology/approach – For effective toughening, various compositions were made by incorporating PNPF at different concentrations. The impact and adhesive strengths of the unmodified and modified epoxy networks were characterised. Findings – The modification of epoxy resin using PNPF showed significant enhancement of impact and adhesive strengths over the unmodified one. The modification caused the formation of a chemical linkage between PNPF and resin which led not only to a phase separation, but also to formation of intrinsically strong chemical bonds across the PNPF phase/resin matrix interphase, which was the main cause of the improved impact and adhesive strengths. The optimum results were obtained at 10 phr (parts per 100 parts of epoxy resin) of modifier. Research limitations/implications – The modifier, PNPF, used in the present context was synthesised from phenol, nonyl phenol and formalin using oxalic acid as catalyst. Practical implications – The developed method provided a simple and practical solution to improving the toughness of a cured epoxy. Originality/value – The method for enhancing toughness of a cured epoxy was novel and could find numerous applications in the surface coating and adhesive.

Item Type:	Journal Article
Publication:	Pigment and Resin Technology
Publisher:	Emerald Group Publishing Limited
Additional Information:	Coopyright of this article belongs to Emerald.
Keywords:	Epoxy resins;Shear strength;Impact strength
Department/Centre:	Division of Chemical Sciences > Materials Research Centre
Date Deposited:	25 Aug 2008
Last Modified:	19 Sep 2010 04:34
URI:	http://eprints.iisc.ac.in/id/eprint/9672

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