Exploiting 2.5D/3D Heterogeneous Integration for AI Computing

Wang, Z and Sun, J and Goksoy, A and Mandal, SK and Liu, Y and Seo, J-S and Chakrabarti, C and Ogras, UY and Chhabria, V and Zhang, J and Cao, Y (2024) Exploiting 2.5D/3D Heterogeneous Integration for AI Computing. In: 29th Asia and South Pacific Design Automation Conference, ASP-DAC 2024, 22 January 2024through 25 January 2024, Incheon, pp. 758-764.

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Abstract

The evolution of AI algorithms has not only revolutionized many application domains, but also posed tremendous challenges on the hardware platform. Advanced packaging technology today, such as 2.5D and 3D interconnection, provides a promising solution to meet the ever-increasing demands of bandwidth, data movement, and system scale in AI computing. This work presents HISIM, a modeling and benchmarking tool for chiplet-based heterogeneous integration. HISIM emphasizes the hierarchical interconnection that connects various chiplets through network-on-package. It further integrates technology roadmap, power/latency prediction, and thermal analysis together to support electro-thermal co-design. Leveraging HISIM with in-memory computing chiplets, we explore the advantages and limitations of 2.5D and 3D heterogenous integration on representative AI algorithms, such as DNNs, transformers, and graph neural networks. © 2024 IEEE.

Item Type:	Conference Paper
Publication:	Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
Publisher:	Institute of Electrical and Electronics Engineers Inc.
Additional Information:	The copyright for this article belongs to Institute of Electrical and Electronics Engineers Inc.
Keywords:	Integrated circuit interconnects; Integration; Three dimensional integrated circuits, 2.5d; 3d; 3D heterogeneous integration; AI algorithms; Applications domains; Chiplet; Hardware platform; Heterogeneous integration; ML accelerator; Performances analysis, Thermoanalysis
Department/Centre:	Division of Electrical Sciences > Computer Science & Automation
Date Deposited:	30 Aug 2024 11:19
Last Modified:	30 Aug 2024 11:19
URI:	http://eprints.iisc.ac.in/id/eprint/84912

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