Shrisha, MR and Chakraborty, Nibir and Mahapatra, Roy D and Sunkara, Sowmya (2018) FPGA based Ultrasonic thickness measuring device. In: 7th International Conference on Computing, Communications and Informatics (ICACCI), SEP 19-22, 2018, Bangalore, INDIA, pp. 779-784.
Full text not available from this repository.Abstract
This paper aims at the development of ultrasound based thickness measurement device. A Spartan 6 FPGA from Xilinx has been used in the hardware design along with external parallel Analog to Digital and digital to Analog converter. The device is interfaced with a PC or laptop through USB cable. A measurement and control software is developed using MATLAB for conceptual level and final Graphical User Interface has been developed in. NET to transfer different user defined control parameters to the hardware and receive the captured signal. Ultrasonic probes are used to generate and receive physical sound wave in pulse-echo mode. Time of flight (ToF) based calculations are used for deriving the subject dimension.
Item Type: | Conference Proceedings |
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Publisher: | IEEE |
Additional Information: | 7th International Conference on Computing, Communications and Informatics (ICACCI), Bangalore, INDIA, SEP 19-22, 2018 |
Keywords: | NDT; Ultrasonic testing; Spartan XC6SLX9 FPGA; DAC Module; ADC Module; Contact Transducer |
Department/Centre: | Division of Mechanical Sciences > Aerospace Engineering(Formerly Aeronautical Engineering) |
Date Deposited: | 15 Feb 2019 08:49 |
Last Modified: | 21 Feb 2019 11:02 |
URI: | http://eprints.iisc.ac.in/id/eprint/61730 |
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