Purohit, Ravi Raj Purohit Purushottam Raj and Arya, Abhinav and Bojjawar, Girish and Pelerin, Maxime and Van Petegem, Steven and Proudhon, Henry and Mukherjee, Soham and Gerard, Celine and Signor, Loic and Mocuta, Cristian and Casati, Nicola and Suwas, Satyam and Chokshi, Atul H and Thilly, Ludovic (2019) Revealing the role of microstructure architecture on strength and ductility of Ni microwires by in-situ synchrotron X-ray diffraction. In: SCIENTIFIC REPORTS, 9 .
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Abstract
Deformation mechanisms of cold drawn and electropolished nickel microwires are studied by performing in-situ monotonous and cyclic tensile tests under synchrotron radiation. X-ray diffraction tests allow probing elastic strains in the different grain families and establishing a link with the deformation mechanisms taking place within the microwires. The measurements were carried out on several microwires with diameters ranging from as-drawn 100 mu m down to 40 mu m thinned down by electropolishing. The as-drawn wires exhibit a core-shell microstructure with <111> fiber texture dominant in core and heterogeneous dual fiber texture <111> and <100> in the shell. Reduction of specimen size by electropolishing results in a higher yield stress and tensile strength along with reduced ductility. In-situ XRD analysis revealed that these differences are linked to the global variation in microstructure induced by shell removal with electropolishing, which in turn affects the load sharing abilities of grain families. This study thus proposes a new way to increase ductility and retain strength in nickel microwires across different diameters by tuning the microstructure architecture.
| Item Type: | Journal Article |
|---|---|
| Publication: | SCIENTIFIC REPORTS |
| Publisher: | NATURE PUBLISHING GROUP |
| Additional Information: | Copyright of this article belongs to NATURE PUBLISHING GROUP |
| Department/Centre: | Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy) |
| Date Deposited: | 06 Feb 2019 05:10 |
| Last Modified: | 06 Feb 2019 05:10 |
| URI: | http://eprints.iisc.ac.in/id/eprint/61586 |
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