Die Level 3D Heterogeneous Integration of a Microfluidic System

Krishna, N P Vamsi and Sen, Prosenjit (2017) Die Level 3D Heterogeneous Integration of a Microfluidic System. In: 19th IEEE Electronics Packaging Technology Conference (EPTC), DEC 06-09, 2017, Singapore, SINGAPORE.

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Abstract

Lab-on-a-chip (LOC) devices has enabled handheld sensing systems for chemical analysis and biological detection. Stacking based integration of various components of an LOC device would lead to system miniaturization and would allow accommodation of more functionalities in a given volume. In this paper, we report a 3D integrated heterogenous system incorporating a silicon photodetector, optical plastic filters, glass microfluidic device and an LED all stacked in 3D and interconnected to function as a fluorescence detection platform. Processing methodology and testing results are reported here.

Item Type:	Conference Proceedings
Series.:	Electronics Packaging Technology Conference Proceedings
Publisher:	IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
Additional Information:	Copy right for the article belong to IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
Department/Centre:	Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited:	28 Mar 2018 16:18
Last Modified:	28 Mar 2018 16:18
URI:	http://eprints.iisc.ac.in/id/eprint/59415

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