Texture evolution during hot deformation of Moly-TZM

Chaudhuri, A and Behera, AN and Kapoor, R and Sarkar, A and Chakravartty, JK and Suwas, S (2015) Texture evolution during hot deformation of Moly-TZM. In: 17TH INTERNATIONAL CONFERENCE ON TEXTURES OF MATERIALS (I, AUG 24-29, 2014, Dresden, GERMANY.

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Abstract

Moly-TZM was deformed at constant strain rate of 1.0 s(-1) to investigate the high strain rate deformation behaviour by microstructural and stress response change within a temperature range of 1400-1700 degrees C. To correlate the deformation behaviour with orientational change, recrystallization and recovery of the material, the microstructural investigation was undertaken using scanning electron microscopy (SEM) of electron back scattered diffraction (EBSD). Depending on the grain size and orientation spread recrystallized grains were identified and texture was calculated. Change in grain boundary characteristics with increasing temperature was determined by the misorientation angle distribution for the deformed and recrystallized grains. Subgrain coalescence and increase in subgrain size with increasing temperature was observed, indicating recrystallization not only occurred from the nucleation of the dislocation free grains in grain boundaries but also from the subgrain rotation and merging of the subgrains by annihilation of the low angle grain boundaries. Detailed studies on the evolution of texture of recrystallized grains showed continuous increase in <001> fiber texture in recrystallised grains, in contrast to a mixed fiber <001> +<111> for the deformed grains.

Item Type:	Conference Proceedings
Series.:	IOP Conference Series-Materials Science and Engineering
Publisher:	IOP PUBLISHING LTD
Additional Information:	Copy right for this article belongs to the IOP PUBLISHING LTD, DIRAC HOUSE, TEMPLE BACK, BRISTOL BS1 6BE, ENGLAND
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	22 Jun 2015 06:26
Last Modified:	22 Jun 2015 06:26
URI:	http://eprints.iisc.ac.in/id/eprint/51737

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