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Overview of systems packaging, packages and high-density interconnect technologies

Mahesh, GV (2011) Overview of systems packaging, packages and high-density interconnect technologies. In: Workshop at National Institute of Technology (NIT), 2011, Trichy.

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Official URL: http://www.nitt.edu/home/
Item Type: Conference Paper
Department/Centre: Division of Electrical Sciences > Electronic Systems Engineering (Formerly Centre for Electronic Design & Technology)
Depositing User: Id for Latest eprints
Date Deposited: 11 Mar 2013 05:29
Last Modified: 11 Mar 2013 05:29
URI: http://eprints.iisc.ac.in/id/eprint/45929

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