Mahesh, GV (2011) Overview of systems packaging, packages and high-density interconnect technologies. In: Workshop at National Institute of Technology (NIT), 2011, Trichy.
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| Item Type: | Conference Paper |
|---|---|
| Department/Centre: | Division of Electrical Sciences > Electronic Systems Engineering (Formerly Centre for Electronic Design & Technology) |
| Date Deposited: | 11 Mar 2013 05:29 |
| Last Modified: | 11 Mar 2013 05:29 |
| URI: | http://eprints.iisc.ac.in/id/eprint/45929 |
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