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Thermal Aware Test Methodology of 3-D Integrated SoC

Vinay, NS and Larsson, Erik and Singh, Virendra (2009) Thermal Aware Test Methodology of 3-D Integrated SoC. In: Workshop on 3-D Integration: Architecture, Design and Test (in conjunction with DATE’09), Apr 2009.

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Item Type: Conference Paper
Department/Centre: Division of Interdisciplinary Research > Supercomputer Education & Research Centre
Depositing User: Ms TV Yashodha
Date Deposited: 16 Dec 2011 07:00
Last Modified: 16 Dec 2011 07:00
URI: http://eprints.iisc.ac.in/id/eprint/41247

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