|
 | Up a level |
Talebanpour, B and Sahaym, U and Dutta, I and Kumar, P (2014) EFFECT OF AGING ON IMPRESSION CREEP BEHAVIOR OF Pb-FREE SOLDERS. In: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, JUL 16-18, 2013, Burlingame, CA.
Kumar, P and Talenbanpour, B and Sahaym, U and Wen, CH and Dutta, I (2012) Microstructural Evolution and Some Unusual Effects During Thermo-Mechanical Cycling of Sn-Ag-Cu Alloys. In: 13th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) , MAY 30-JUN 01, 2012 , San Diego, CA , pp. 880-887.
Kumar, P and Mishra, A and Watt, T and Watt, I and Bourell, DL and Sahaym, U (2013) Electromagnetic jigsaw: metal-cutting by combining electromagnetic and mechanical Forces. In: PROCEEDINGS OF THE SEVENTEENTH CIRP CONFERENCE ON ELECTRO PHYSICAL AND CHEMICAL MACHINING (ISEM), 6 . pp. 600-604.
