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Paul, Milova and Kumar, BSampath and Gossner, Harald and Shrivastava, Mayank (2018) Contact and Junction Engineering in Bulk FinFET Technology for Improved ESD/Latch-up Performance with Design Trade-offs and its Implications on Hot Carrier Reliability. In: 2018 IEEE International Reliability Physics Symposium, IRPS 2018; Burlingame; United States; 11 March, 11-15 March 2018, Burlingame, CA, USA.
