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Conference Paper

Kamble, SN and Kubair, DV and Ramamurthy, U (2009) Indentation strength of a piezoelectric ceramic: Experiments and simulations. In: International Symposium on Indentation Behavior of Materials, MAR 2009, Hyderabad, pp. 926-935.

Kubair, DV and Renji, K (2008) Shock wave propagation and attenuation in layered composites. In: Proceedings of 24th Annual Inhouse Symposium on Space Science and Technology , January 2008, Bangalore.

Dilip, C and Sriranga, TS and Samuel, R and Behera, Raghunath and Kubair, DV and Bobji, MS (2008) Strain field measurement using digital image correlation. In: Proceedings of 24th Annual Inhouse Symposium on Space Science and Technology, January 2008, Bangalore.

Journal Article

Kubair, DV and Bhanu-Chandar, B (2008) Stress concentration factor due to a circular hole in functionally graded panels under uniaxial tension. In: International Journal of Mechanical Sciences, 50 (4). pp. 732-742.

Kubair, DV and Lakshmana, BK (2008) Cohesive modeling of low-velocity impact damage in layered functionally graded beams. In: Mechanics Research Communications, 35 (1-2). pp. 104-114.

Kubair, DV and Chandar, Bhanu B (2007) Mode-3 spontaneous crack propagation along functionally graded bimaterial interfaces. In: Journal of the Mechanics and Physics of Solids, 55 (6). pp. 1145-1165.

Kubair, DV and Spearing, SM (2007) Cohesive zone model for direct silicon wafer bonding. In: Journal of Physics D-Applied Physics, 40 (10). pp. 3070-3076.

Kulkarni, MG and Pal, S and Kubair, DV (2007) Mode-3 spontaneous crack propagation in unsymmetric functionally graded materials. In: International Journal of Solids and Structures, 44 (1). pp. 229-241.

Pal, S and Kulkarni, MG and Kubair, DV (2007) Mode-3 spontaneous crack propagation in symmetric functionally graded materials. In: International Journal of Solids and Structures, 44 (1). pp. 242-254.

Pal, S and Kubair, DV (2006) Finite element simulations of microvoid growth due to selective oxidation in binary alloys. In: Modelling and Simulation in Materials Science and Engineering, 14 (7). pp. 1211-1223.

Kubair, DV and Spearing, SM (2006) Cohesive zone modelling of wafer bonding and fracture: effect of patterning and toughness variations. In: Journal of Physics D: Applied Physics, 39 (6). pp. 1050-1057.