Number of items: 2.
Conference Proceedings
Krishna, Vamsi NP and Sen, Prosenjit
(2016)
3D Die Level Packaging for Hybrid Systems.
In: IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), MAY 23-26, 2016, San Jose, CA, pp. 120-122.
Chhabra, Priya and Sharma, Anurekha and Krishna, Vamsi NP
(2016)
Fabrication and characterisation of bulk micromachined ZnO energy transducer with interdigitated electrodes.
In: 2nd International Conference on Surfaces, Coatings and Nanostructured Materials - Asia (NANOSMAT-Asia), MAR 24-27, 2015, Kayseri, TURKEY, pp. 1055-1066.
This list was generated on Fri Apr 19 08:57:27 2024 IST.
