Number of items: 2.
Conference Proceedings
Krishna, N P Vamsi and Sen, Prosenjit
(2017)
Die Level 3D Heterogeneous Integration of a Microfluidic System.
In: 19th IEEE Electronics Packaging Technology Conference (EPTC), DEC 06-09, 2017, Singapore, SINGAPORE.
Krishna, N P Vamsi and Ramesh, Nayana and Mohan, Nagaboopathy and Muralidharan, Rangarajan and Raghavan, Srinivasan and Nath, Digbijoy N and Sen, Prosenjit
(2017)
Gallium Nitride transistor on glass using epoxy mediated substrate transfer technology.
In: 19th IEEE Electronics Packaging Technology Conference (EPTC), DEC 06-09, 2017, Singapore, SINGAPORE.
This list was generated on Fri Jan 31 02:33:42 2025 IST.
