Up a level |
Yamaguchi, Masahiro and Yanai, Takeshi and Nakayama, Hidetoshi and Sai, Ranajit and Fujiwara, Hiroaki and Kitai, Yuki and Sato, Mikio and Sangawa, Ushio (2018) Skin Effect Suppressed Ni-Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board. In: IEEE TRANSACTIONS ON MAGNETICS, 54 (11).