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Laurila, T and Karppinen, J and Vuorinen, V and Li, J and Paul, A and Paulasto-Krockel, M (2012) Effect of isothermal aging and electromigration on the microstructural evolution of solder interconnections during thermomechanical loading. In: Journal of Electronic Materials, 41 (11). pp. 3179-3195.
Laurila, T and Karppinen, J and Vuorinen, V and Paul, A and Paulasto-Krockel, M (2011) Effect of Constant and Cyclic Current Stressing on the Evolution of Intermetallic Compound Layers. In: Journal of Electronic Materials, 40 (7). pp. 1517-1526.