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Laurila, Tomi and Paul, Aloke and Dong, Hongqun and Vuorinen, Vesa (2017) Thermodynamic-Kinetic Method on Microstructural Evolutions in Electronics. [Book Chapter]
Santra, Sangeeta and Dong, Hongqun and Laurila, Tomi and Paul, Aloke (2014) Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions. In: PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES, 470 (2161).