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Nittala, PVK and Haridas, K and Sen, P (2022) Heterogeneous Integration by the 3D Stacking of Thin Silicon Die. In: 72nd IEEE Electronic Components and Technology Conference, ECTC 2022, 31 May - 3 June 2022, San Diego, pp. 608-613.

This list was generated on Mon Apr 15 22:09:21 2024 IST.