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Number of items: 2.

Das, Subhas Chandra and Narayanan, G and Tiwari, Arvind (2018) Experimental study on the influence of junction temperature on the relationship between IGBT switching energy loss and device current. In: MICROELECTRONICS RELIABILITY, 80 . pp. 134-143.

Ghosh, Rituparna and Kanjilal, Anwesha and Kumar, Praveen (2017) Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints. In: MICROELECTRONICS RELIABILITY, 74 . pp. 44-51.

This list was generated on Thu Feb 22 20:13:13 2024 IST.