Number of items: 2.
Das, Subhas Chandra and Narayanan, G and Tiwari, Arvind
(2018)
Experimental study on the influence of junction temperature on the relationship between IGBT switching energy loss and device current.
In: MICROELECTRONICS RELIABILITY, 80
.
pp. 134-143.
Ghosh, Rituparna and Kanjilal, Anwesha and Kumar, Praveen
(2017)
Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints.
In: MICROELECTRONICS RELIABILITY, 74
.
pp. 44-51.
This list was generated on Thu Apr 25 14:18:24 2024 IST.
