Number of items: 2.
Nittala, PVK and Haridas, K and Nigam, S and Tasneem, S and Sen, P
(2021)
Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies.
In: Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics, 39
(5).
Niranjan, S and Guiney, I and Humphreys, CJ and Sen, P and Muralidharan, R and Nath, DN
(2020)
Au-free recessed Ohmic contacts to AlGaN/GaN high electron mobility transistor: Study of etch chemistry and metal scheme.
In: Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics, 38
(3).
This list was generated on Wed Apr 24 08:40:19 2024 IST.
