Number of items: 2.
Journal Article
Nittala, PVK and Haridas, K and Nigam, S and Tasneem, S and Sen, P
(2021)
Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies.
In: Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics, 39
(5).
Nittala, PVK and Remesh, N and Niranjan, S and Tasneem, S and Raghavan, S and Muralidharan, R and Nath, DN and Sen, P
(2020)
Enabling Transfer of Ultrathin Layers of GaN for Demonstration of a Heterogenous Stack on Copper Heat Spreader.
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, 10
(2).
pp. 339-342.
This list was generated on Wed Jan 15 11:53:33 2025 IST.
