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Conference Paper

Nittala, PVK and Haridas, K and Sen, P (2022) Heterogeneous Integration by the 3D Stacking of Thin Silicon Die. In: 72nd IEEE Electronic Components and Technology Conference, ECTC 2022, 31 May - 3 June 2022, San Diego, pp. 608-613.

Journal Article

Nittala, PVK and Haridas, K and Nigam, S and Tasneem, S and Sen, P (2021) Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies. In: Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics, 39 (5).

This list was generated on Sun Dec 22 11:39:29 2024 IST.