Spontaneous crack propagation along functionally graded bimaterial interfaces

Kubair, DV and Bhanu-Chandar, B (2006) Spontaneous crack propagation along functionally graded bimaterial interfaces. In: 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006, 5 November 2006 through 10 November 2006.

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Abstract

The effects of spatially varying the material properties on the mode-3 planar crack propagation characteristics are numerically investigated. The spectral scheme that is available for homogeneous materials is modified to account for the asymmetrically varying material properties. Crack propagation along the interface of a functionally graded bimaterial system has been simulated. A parametric study was performed by systematically varying the material inhomogeneity length scale independently in the two half-spaces. Our study indicated that softening type graded materials reduce the resistance to fracture, while a hardening material offers higher fracture resistance with increase in inhomogeneity. Only the transient phase of crack propagation speed was affected by the material property variation, irrespective of whether the material was hardening, softening or an asymmetric type. The crack always reached a quasi-steady-state velocity, which remained unaffected by the material property inhomogeneity. Copyright © 2006 by ASME.

Item Type:	Conference Paper
Publication:	American Society of Mechanical Engineers, Applied Mechanics Division, AMD
Publisher:	American Society of Mechanical Engineers (ASME)
Additional Information:	The copyright for this article belongs to American Society of Mechanical Engineers (ASME).
Keywords:	Crack propagation; Fracture toughness; Functionally graded materials; Hardening; Parameter estimation; Velocity measurement, Asymmetric types; Bimaterial system; Inhomogeneity; Material properties, Interfaces (materials)
Department/Centre:	Division of Mechanical Sciences > Aerospace Engineering(Formerly Aeronautical Engineering)
Date Deposited:	25 Sep 2024 05:34
Last Modified:	25 Sep 2024 05:34
URI:	http://eprints.iisc.ac.in/id/eprint/85685

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