System Level Simulation and Fabrication of SOI-MEMS Differential Capacitive Accelerometer

Veena, S and Suresh, HL and Rai, N and Veerapandi, N and Nagaraj, VS (2023) System Level Simulation and Fabrication of SOI-MEMS Differential Capacitive Accelerometer. In: Journal of Applied Science and Engineering (Taiwan), 27 (3). pp. 2251-2257.

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Abstract

This study primarily covers the design and development of an MEMS based accelerometer. Frequency, displacement sensitivity, and capacitance are the subject of analytical modelling; the corresponding values are found to be 7.41kHz, 4.509610-9 m/g, and 0.289pF respectively. COMSOL Multiphysics is used to design the structure of accelerometer and the MATLAB simulator tool is used to analyse the accelerometer. In order to obtain precise results, simulations are done and theoretical calculations are compared. Silicon-on-Insulator Multi-User MEMS Processes (SOIMUMPS) technology is employed to fabricate the accelerometer structure at MEMSCAP foundry, United State. The characterization of the fabricated device is done at CENSE, IISc, Bangalore. The capacitance values on either side of the device obtained from the test results are 0.36pF and 0.85pF when 5 V is applied to the electrodes. The proposed accelerometer is employed in the actuating parts of the sensor due to its properties like linearity and low sensitivity. © 2023 Authors. All rights reserved.

Item Type:	Journal Article
Publication:	Journal of Applied Science and Engineering (Taiwan)
Publisher:	Tamkang University
Additional Information:	The copyright for this article belongs to the Tamkang University
Keywords:	Capacitance; Fabrication; MATLAB; Silicon on insulator technology; Structural design, Capacitive accelerometers; Characterization; COMSOL; Design and Development; MEM capacitive accelerometer; Multi-physics; Sensitivity; SOI MUMPs; SOI-MEMS; System level simulation, Accelerometers
Department/Centre:	Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited:	20 Dec 2023 04:09
Last Modified:	20 Dec 2023 04:09
URI:	https://eprints.iisc.ac.in/id/eprint/83522

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