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The Consequence of SiC Filler Content on the Mechanical, Thermal, and Structural Properties of a Jute/Kevlar Reinforced Epoxy Hybrid Composite

Behera, A and Dehury, J and Rayaguru, BP (2023) The Consequence of SiC Filler Content on the Mechanical, Thermal, and Structural Properties of a Jute/Kevlar Reinforced Epoxy Hybrid Composite. In: Silicon .

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Official URL: https://doi.org/10.1007/s12633-023-02543-y

Abstract

The hybridization of SiC filler and synthetic fiber in a polymer matrix composite has great potential to improve radiation shielding, strength, hardness, and thermal stability. In this work, SiC particle-filled Kevlar/Jute/Epoxy hybrid composite was fabricated using the hand-lay-up technique for the first instant. The effect of SiC filler was investigated in five different laminates (JKKJ-5%, JKKJ-10%, JKKJ-15%, JKKJ-20%, and JKKJ-25%) with varying SiC weight %. Properties like tensile, flexural, impact strength, thermal conductivity, and thermal resistance were analysed. Finally, the fractured specimen was analysed using scanning electron micrographs. The tensile, flexural, and impact strength was maximum for JKKJ-10%, JKKJ-5%, and JKKJ-25% specimens, respectively. Increased SiC filler reduced the thermal conductivity and improved the thermal resistance to 20 filler wt %. The SEM fracture morphology revealed that fiber pull-out, fiber failure, micro voids due to air entrapment, entrapped bubbles, and out-off-plane shear failure were the majorly observed failure mechanism. Considering all the fabricated Kevlar/Jute/SiC/Epoxy laminates, the JKKJ-10% specimen showed the best average mechanical and thermal properties.

Item Type: Journal Article
Publication: Silicon
Publisher: Springer Science and Business Media B.V.
Additional Information: The copyright for this article belongs to the Hybrid Composite; Jute; Kevlar; Polymer Matrix; Silicon Carbide.
Keywords: Hybrid Composite; Jute; Kevlar; Polymer Matrix; Silicon Carbide
Department/Centre: Division of Mechanical Sciences > Mechanical Engineering
Date Deposited: 13 Jul 2023 09:45
Last Modified: 13 Jul 2023 09:45
URI: https://eprints.iisc.ac.in/id/eprint/82419

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